Laser Cutter
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  • S035-50
  •   Photo
    •   Product features
    • Silicon wafer laser slicer is mainly used for solar battery and semiconductor industries, and can cut, slice or carve single crystal silicon, polycrystalline silicon, non-crystalline silicon, germanium, gallium arsenide and other semiconductor materials. The laser cutting is non-contact cutting, it is the best choice for silicon wafer cutting industries, it can achieve wafer cutting of various specifications and do no damage on wafer surface, and the product performance after cutting will not be changed, so that the production efficiency and rate of finished products can be largely improved. The control software adopts general-purpose cutting software which is developed by us, supports Windows, and supports DXF, PLT, CNC and other figure formats, so that it can do cutting composed by complicated curves and so on. The following models are small in size, high in slicing precision and slicing speed, stable, and with no pollution and low noise.
    • S035-50
    • The slicer adopts ND:YAG laser unit, of which maximum output power is 50W, with a cross worktable, double-service-position cutting and vacuum sucker, so that it can largely improve the working efficiency.
    • With high cost performance, the slicer is the most popular and practical model for solar silicon chip slicing of the present stage.
    •   Applications & materials
    • Silicon wafer laser slicer is mainly used for solar battery and semiconductor industries, and can cut, slice or carve single crystal silicon, polycrystalline silicon, non-crystalline silicon, germanium, gallium arsenide and other semiconductor materials.
    •   Technical data
    • Laser unit type Lamp-pump YAG laser unit
      Laser wavelength 1064nm
      Max. laser power 50W
      Beam quality ≤10
      Max. idle speed 150mm/s
      Max. cutting speed 120mm/s
      Max. cutting depth 0.8mm
      Min. line width 0.04mm
      Repeating positioning accuracy ≤0.01mm
      Positioning accuracy ≤±0.01mm
      Worktable scope 350mm×350mm (Customizable)
      Total power 5KW
      Electrical source 220V/ 50Hz / 20A
      Total weight 455Kg
      Optical system dimensions (W×L×H) 1750mm×1150mm×720mm
    •   Sample
    • Solar silicon slice cutting

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  • Han's Laser Technology Corporation, 12440 Oxford Park Dr. Suite B111, Houston, TX 77082    Copyrights  2009