Laser Cutter
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  • CS0405-100/150/250
  •   Photo
    •   Product features
    • Ceramic laser cutter is a new model we developed recently, it is mainly for slicing and cutting of ceramic base plate of electronic industry and other fragility materials. It is widely used for: Thick film circuit, large-scale IC, mixed IC, semiconductor package, slice resistor, network resistor, focusing potentiometer, power module, power mixed circuit and other relevant fields. This series models adopt imported high-performance CO2 laser unit. Stable power, high-quality beam, fine mode, and maintenance-free. It can cut various special-shaped figure on ceramic base plate. High processing precision, high cutting quality. It is non-contact processing type, so that the ceramic base plate will not be broken when cutting. Optional laser unit power: 100W, 150W, and 250W.
    • CS0405 is a general-purpose model for medium- and low-end cutting. Low cost, high performance, and high cost performance.
    • The movement parts adopt high-precision ball screws, straight-line guiding rail, and servo system, so its positioning precision and cutting speed is high;
    • Industrial PC control is Windows operation platform, and the software is the dedicated software we developed specially. It is general-used, and convenient for operation;
    • The base adopts high rigidity low-deformation granite with double layer dustproof system and subatmospheric pressure dust-removing device.
    •   Applications & materials
    • Ceramic laser cutter is a new model we developed recently, it is mainly for slicing and cutting of ceramic base plate of electronic industry and other fragility materials. It is widely used for: Thick film circuit, large-scale IC, mixed IC, semiconductor package, slice resistor, network resistor, focusing potentiometer, power module, power mixed circuit and other relevant fields.
    •   Technical data
    •   CS0405-100 CS0405-150 CS0405-250
      Laser unit type CO2 CO2 CO2
      Laser wavelength 10.64μm 10.64μm 10.64μm
      Max. laser power 100W 150W 250W
      Beam quality M2 ≤1.5 ≤1.5 ≤1.5
      Max. idle speed 150mm/sec 150mm/sec 150mm/sec
      Max. cutting speed 6mm/sec 6mm/sec 6mm/sec
      Cutting depth 1.2mm 1.5mm 1.5mm
      Min. line width 0.09mm 0.09mm 0.09mm
      Repeating positioning accuracy ≤0.01mm ≤0.01mm ≤0.01mm
      Worktable scope 500mm×400mm 500mm×400mm 500mm×400mm
      Total power 6KW 6KW 8KW
      Electrical source 220V/50Hz/35A 220V/50Hz/35A 220V/50Hz/60A
      Weight 2000kg 2000kg 2200kg
      Optical system dimensions (W×L×H) 1980mm×1128mm×1342mm 1980mm×1128mm×1342mm 1980mm×1128mm×1342mm
    •   Sample
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  • Han's Laser Technology Corporation, 12440 Oxford Park Dr. Suite B111, Houston, TX 77082    Copyrights  2009