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All Products >> LaserCutter >> Automatic Silicon Wafer Cutter >> UV-5C
- UV-5C
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- Product features
- Han's Laser UV-5C UV full-automatic silicon wafer cutter adopts 355nm ultraviolet laser unit as laser source of which power is high. The focusing facula of UV beam I extremely small, it can achieve extremely fine cutting. Ultraviolet laser processing is a kind of “cold processing”, “cold” cutting makes the heat affecting area extremely small, and the non-contact processing method will not produce stress in crystalline grain, so that the rate of finished products of crystalline grain is high, and the electric performance parameters is much better than those of mechanical cutting. High-precision and automatic system configurations makes the cutting speed, material utilization ratio, use cost better than those of mechanical cutting method.
- System configurations
- High-power 355nm UV laser unit, Han's Laser patented product;
- High-precision 2D platform; High-precision rotary platform;
- Full-automatic loading and unloading device;
- High-precision CCD positioning system;
- Air cooling system is more convenient than the water cooling method of mechanical cutting, and cut the use cost.
- System features
- High laser beam quality, small focusing facula, narrow cut, small heat affecting area;
- Smooth and neat cut without crackle, high rate of finished products;
- High productivity, close cut, high area utilization ratio of wafer.
- Full-automatic loading and unloading, automatic image processing, non-manual operation.
- High cutting speed, efficiency and precision.
- Non-contact processing, no materials replacement, low use and maintenance cost.
- Computerized control during whole course, abnormal signal feedback.
- Stable performance allows long-term operation.
- Applications & materials
- It is mainly used for slicing and cutting of silicon wafer and IC crystalline grain, and can be used for slicing and fine processing of sapphire, ceramic thin slice, polymer film and other materials.
- Technical data
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Laser wavelength 355nm Laser power 5W@10KHz Repetition rate 8-15KHz Cutting depth 0.05mm-0.4mm Cutting width 0.02mm-0.05mm Cutting speed 10-100mm/s Positioning accuracy ±0.005mm X/Y-axis repeating positioning accuracy ±0.002mm Running accuracy ±0.001° Total power 4KW Optical system dimensions (L×W×H) 1850mm×1300mm×2000mm Cooling system (L×W×H) 343mm×650mm×715mm - Sample
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Wafer cutting sample
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