Products
- Providing authoritative solutions of lasers
-
All Products >> LaserCutter >> Laser Slicer >> FS10
- FS10
Photo
-
- Product features
- Fiber optic laser slicer is the 2nd generation slicer which was developed according to the needs of solar silicon wafer cutting and semiconductor cutting, and it adopts the most advanced fiber optic laser unit in the world, of which the maximum output power is 10W. Higher laser quality, narrower beam, smaller heat affecting area at wafer cut. Efficiency of photoelectricity conversion of the fiber optic laser unit is high. It adopts air cooling method and internal industrial PC control, so that the complete set is small in size with low power consumption. 2D automatic precision worktable can do precise movement through control card. The slicer is provided with absorption system, and can be installed with an ash-intake system according to the requirement of the customer. For stable performance and high reliability, it can work for 24 hours uninterruptedly.
- Applications & materials
- solar silicon wafer cutting and semiconductor cutting
- Technical data
-
Laser unit type Fiber optic laser unit Laser wavelength 1064nm Max. laser power 10W Beam quality ≤1.8 Max. idle speed 100mm/s Max. cutting speed 80mm/s Max. cutting depth 0.5mm Min. line width 0.02mm Repeating positioning accuracy ≤0.02mm Positioning accuracy ≤±0.02mm Worktable scope 300mm×300mm Total power 700W Electrical source 220V/ 50Hz / 10A Total weight 250Kg Optical system dimensions (W×L×H) 710mm×570mm×1245mm - Sample
-
Solar silicon slice cutting
Quote
Print